Re-Tinning
Why Tin Components?
- Eliminate Tin Whiskers: Tin whiskers can cause shorts in high-reliability applications. Tinning removes 100% of pure tin and replaces it with a controlled alloy to prevent whisker growth.
- Enhance Solderability: Over time, oxidation can degrade component leads, reducing solderability. Tinning restores the solderability of components and extends their lifespan.
- Convert Finishes: Components can be refinished with SnPb (Tin-Lead), RoHS-compliant SAC305, or other specialized alloys as required.
- Meet Industry & Military Standards: Our tinning process ensures compliance with industry regulations, preventing weak solder joints and improving reliability.
Our Tinning Process
1. Surface Preparation & Lead Refinishing:
- Components undergo an oxidation removal process before tinning.
- This step ensures all surfaces are clean, oxide-free, and properly prepped for solder application.
2. Hot Solder Dip (HSD) Application:
- Robotic Hot Solder Dip (RHSD) Technology ensures uniform tinning while preventing damage to sensitive components.
- Process is controlled for dwell time, depth, and temperature to ensure consistent application.
3. Solder Alloy Selection & Application:
- Components can be refinished with lead-free SAC305, SnPb (Tin-Lead), or custom solder alloys based on project requirements.
- Gold removal is performed per J-STD-001 to eliminate excessive gold content and ensure a robust solder joint.
4. Final Inspection & Verification:
- XRF (X-ray Fluorescence) scanning verifies the finish composition and ensures compliance with required standards.
- Solderability testing confirms the components meet quality specifications and are ready for use.
Application-Specific: Reballing & Tinning Solutions
For mission-critical and high-reliability applications, we provide customized tinning and reballing solutions, including:
- LGA & QFN Reballing: Conversion of Land Grid Arrays (LGAs) and Quad Flat No-lead (QFN) packages.
- Ceramic CLCC Solder Sphere Attachment: Solutions for improving thermal expansion and joint reliability in Ceramic Leadless Chip Carriers (CLCCs).
- Custom Alloy Finishes: Refinishing components with high-reliability solders, including high-melting point (HMP) alloys for aerospace and military applications.
Why Choose The Lab WorldWide for Tinning & Reballing?
✔ Automated Processing – Eliminates human error and ensures consistency. ✔ MIL-SPEC Compliance – All services meet industry-leading standards for quality and reliability. ✔ Enhanced Component Longevity – Improves performance and lifespan of critical components. ✔ Certified Testing & Validation – Comprehensive XRF, solderability, and AOI testing for every processed component. ✔ Cost-Effective & Sustainable – Reduces e-waste and allows for component reuse, saving costs on new parts.