RE-BALLING SERVICES
Why Re-ball?
- Convert from lead-free (SAC 305) to lead-based solder or vice versa.
- Restore high-value components for reuse.
- Address oxidation and handling damage.
- Improve coefficient thermal expansion mismatch (CTE) in LCCs and LGAs.
- Strengthen solder joints to enhance long-term reliability.
Our Reballing Process Our automated reballing system eliminates inconsistencies caused by traditional manual processes. By automating flux application, ball placement, and inspection, we ensure superior precision, repeatability, and quality assurance.
Our Re-Balling Process
1. Tin Removal & Cleaning:
- We remove all existing solder balls and any remaining alloy residue using a controlled, non-contact process.
- Cleaning is performed using a high-speed polishing and surface preparation process, ensuring optimal pad readiness for new solder ball attachment.
2. Flux Application & Ball Placement:
- Flux is applied via an automated process, ensuring an even distribution for enhanced adhesion.
- New solder balls are aligned and attached with high-precision placement technology.
3. Reflow & Solidification:
- The reflow process securely attaches the new solder balls using controlled temperature profiles, minimizing thermal stress.
- For high-reliability applications, reflow reballing remains a cost-effective and widely accepted industry standard.
4. Inspection & Sorting:
- Integrated AOI (Automated Optical Inspection) and CCD positioning systems ensure each component meets strict quality standards.
- Defective or non-compliant components are automatically sorted out, ensuring only fully reworked and functional devices are delivered to customers.
Why Choose The Lab WorldWide for Tinning & Reballing?
✔ Automated Processing – Eliminates human error and ensures consistency. ✔ MIL-SPEC Compliance – All services meet industry-leading standards for quality and reliability. ✔ Enhanced Component Longevity – Improves performance and lifespan of critical components. ✔ Certified Testing & Validation – Comprehensive XRF, solderability, and AOI testing for every processed component. ✔ Cost-Effective & Sustainable – Reduces e-waste and allows for component reuse, saving costs on new parts.