The Lab Worldwide Services

Test Explanation: A solvent-based analysis that dissolves surface coatings to evaluate their integrity and identify counterfeit or altered materials.

• Scenario: Suspected counterfeit components show unusual surface finishes. This test dissolves the coating, revealing underlying inconsistencies or fraudulent alterations.

Test Explanation: This test measures the physical dimensions of components to ensure they align with manufacturer specifications using tools like calipers or non-contact measuring systems.

• Scenario: A supplier delivers parts with inconsistent dimensions, suggesting possible counterfeit manufacturing. Dimensional checks confirm whether the parts meet original specifications or indicate counterfeit origins.

Test Explanation: This test evaluates the durability of markings on components, ensuring they do not fade, smear, or degrade under various environmental conditions.

• • Scenario: Components arrive with suspicious secondary markings. Permanency testing reveals whether the markings are legitimate or fraudulent re-markings intended to disguise counterfeit products.

Test Explanation: This test applies acetone to the surface of components to assess the durability of coatings and markings, revealing any counterfeit or substandard finishes.

• Scenario: A batch of components shows signs of possible overcoating to mask prior markings. Acetone testing determines whether the coating is original or part of a counterfeit masking process.

Test Explanation: This test uses a specialized solvent to evaluate the resilience of coatings, ensuring they meet industry standards for durability and performance.

• Scenario: Coatings on components appear uneven and inconsistent with original specifications. Dynasolve testing confirms whether these coatings are genuine or applied as part of a counterfeit scheme.

Test Explanation: This destructive test removes the outer layers of a component to expose and analyze internal die markings and structures for authenticity verification.

• Scenario: Components suspected of being counterfeit are decapsulated to reveal incorrect or missing die markings, proving their inauthenticity.

Test Explanation: A non-destructive imaging technique that provides internal views of components to detect hidden defects, such as voids, cracks, or misalignments.

• Scenario: Suspected counterfeit parts exhibit inconsistencies in internal structures, such as missing wire bonds. X-ray inspection uncovers these internal anomalies without damaging the components.

Test Explanation: An elemental analysis method that verifies material composition and compliance with industry standards, such as RoHS.

• Scenario: Components from an unreliable source are suspected of containing prohibited materials. XRF inspection detects discrepancies in material composition that indicate counterfeit origins.

Test Explanation: This destructive analysis reveals internal layers of a component to identify manufacturing defects or evaluate structural integrity.

• Scenario: Components fail during soldering, raising suspicions of counterfeit or substandard materials. Cross-section analysis uncovers internal defects indicative of poor manufacturing or counterfeit processes.

Test Explanation: A non-destructive test that uses acoustic imaging to detect internal defects such as delaminations, voids, or cracks.

• Scenario: A batch of high-reliability components shows potential signs of delamination. CSAM confirms internal defects, which are often indicative of counterfeit or poorly manufactured parts.

Test Explanation: A combination of scanning electron microscopy and energy dispersive spectroscopy to analyze surface structures and elemental composition with high precision.

• Scenario: Suspected counterfeit semiconductors require detailed surface and elemental analysis. SEM/EDS identifies deviations in material composition and manufacturing techniques that suggest inauthentic origins.

Test Explanation: This test evaluates the ability of component leads to form reliable solder joints under standard conditions.

• Scenario: Components suspected of having counterfeit or altered leads fail to solder correctly during production. Solderability testing confirms issues with lead quality or material inconsistencies.

Test Explanation: Verifies the basic electrical parameters of a component, such as resistance, capacitance, or voltage, to confirm functionality.

• Scenario: A batch of components with suspicious markings is tested for basic DC functionality. Failures in expected parameters indicate counterfeit or re-marked devices.

Test Explanation: This process removes moisture from components and seals them in moisture-resistant packaging for long-term storage.

• Scenario: A suspicious batch of components arrives with signs of improper storage. Baking and dry packing restore their usability and verify they meet environmental resistance standards.