COMPONENT HARVESTING
Recover & Reuse High-Value Components
As electronic components become increasingly difficult to source due to obsolescence, long lead times, or high costs, The Lab WorldWide offers precision component harvesting services to recover valuable chips from non-functional or obsolete circuit boards. By safely removing, refinishing, and verifying components for reuse, we help customers extend the lifecycle of their high-reliability devices, reducing the need for costly redesigns or replacements.
Why Harvest Components?
• Obsolescence Management: Recover discontinued or hard-to-find components for repairs and upgrades.
• Cost Savings: Reuse expensive ICs and specialty devices instead of sourcing new components.
• Sustainability: Reduce electronic waste by repurposing functional components.
• Reliability Assurance: All harvested components are verified for performance and refinished to meet industry standards.
Our Safe & Precise Component Removal Process
We utilize fully automated, non-contact rework and reflow systems to ensure precision component removal without damaging leads, pads, or underlying structures. Our state-of-the-art systems provide:
Heat
Heated stages with focused, forced hot air for precise control over temperature ramp-up, peak time, and ramp-down.
Elimination
Elimination of thermal stress and mechanical damage to both the harvested component and the circuit board.
Support
Support for all package types, including QFPs, BGAs, LGAs, and multi-pin through-hole connectors.
Component Refinishing & Re-Qualification
Once removed, components undergo a rigorous reconditioning process to ensure their usability and reliability for future applications:
Robotic Hot Solder Dip (RHSD) for Lead Refinishing
- Removes excess solder and refinishes leads to RoHS-compliant or Sn63/Pb37 finishes.
- Ensures compliance with GEIA-STD-0006 & IPC-J-STD-001.
BGA Reballing Services
- Restores BGAs with industry-standard solder balls (SnPb or SAC305).
- Adheres to IEC TS62647-4 & IPC-J-STD-002 standards.
Solderability Testing & XRF Analysis
- Verifies that harvested components meet performance and compliance requirements.
Moisture Sensitivity Handling & Packaging
To ensure the longevity and reliability of harvested components, all parts are processed and packaged according to J-STD-020 and J-STD-033 standards:
Pre-baking
We Pre-bake before salvage to remove moisture and prevent damage.
Vacuum-sealed ESD barrier packaging
We use vacuum-sealed ESD barrier packaging with desiccant packs and moisture sensitivity indicators.
Re-tape & reel packaging
Re-tape & reel packaging available for automated assembly lines (EIA-481E compliant).
Maximize Component Longevity & Reduce Costs
Whether you need to recover high-value components for repairs or maintain your legacy systems, The Lab WorldWide provides a safe, reliable, and cost-effective solution for component harvesting and reuse. Contact us today to discuss your specific requirements!