Electronics Failure Analysis & Forensic Support

The Lab Worldwide specializes in Electronics Failure Analysis & Forensic Support 

The Lab Worldwide provides specialized electronics testing, failure analysis, and material characterization services to support forensic engineering firms, insurance investigations, and product liability cases.

Our lab bridges the gap between component-level evidence and root cause determination, delivering clear, defensible technical findings suitable for litigation and expert reports.

 

    Core Capabilities

    Our 7-step forensic analysis process ensures precision, quality, and reliability:

    1. Non-Destructive Internal Inspection - Visual & Dimensional Inspection
    X-Ray Radiography — TruView Prime & X-Ray 5600 Microfocus
    • High-resolution 2D radiography for internal inspection of components and assemblies
    • Microfocus source for fine feature detection (solder joints, bond wires, voids)
    • Adjustable magnification and contrast for multi-material systems

    Scanning Electron Microscopy (SEM) — Phenom XL

    • High-resolution imaging for microstructural evaluation of metals, solder joints, and interconnects
    • Backscattered electron imaging for compositional contrast (phase distribution, inclusions, plating layers)
    • Detailed surface morphology analysis (fracture surfaces, arc damage, melting, re-solidification features)
    • Grain boundary visualization and defect identification at micron and sub-micron scale
    • Seamless integration with EDX for localized elemental correlation
    Scanning Acoustic Microscopy (CSAM) — OKOS VUE-250-P
    • Non-destructive ultrasonic imaging for internal interfaces
    • Detection of delamination, voids, and cracks within packages
    • Depth-resolved analysis using gated C-scan imaging
    XRF Material Analysis
    • Non-destructive bulk elemental screening for rapid alloy identification
    • Quantification of plating systems (Ni/Au, Sn, Ag) including thickness trends and uniformity issues
    • Detection of restricted or anomalous elements for RoHS and compliance verification
    • Identification of material substitution or counterfeit indicators (composition mismatch vs datasheet or known-good parts)
    2. Destructive Physical Analysis (DPA)
    • IC decapsulation (acid & thermomechanical)
    • Die and bond wire inspection
    • Cross-section analysis of leads and packages
    • Internal failure site identification

    Applications:

    • Semiconductor failure root cause
    • Counterfeit component verification
    • Electrical overstress (EOS) / ESD damage analysis
    3. Electrical Characterization (Screening & Correlation)
    • Basic parametric checks (DC, curve trace, diode/impedance)
    • Functional verification (pass/fail)
    • Optional temperature conditioning and stress pre-screen

    Role in Forensics:

    • Rapid triage to classify components (open/short/degraded)
    • Correlate physical defects with electrical behavior
    • Provide supporting data for client-led detailed analysis
    4. Environmental & Reliability Testing
    • Thermal shock testing
    • Burn-in stress testing
    • Temperature upscreen testing
    5. Material & Metallurgical Analysis
    Energy Dispersive X-ray Spectroscopy (EDS/EDX)
    • Elemental composition analysis at localized regions (micron-scale when paired with SEM)
    • Identification of foreign materials, contamination, and corrosion products
    • Verification of alloy systems and material conformance
    • Residue analysis from electrical overstress (EOS), arcing, or thermal events
    Forensic Applications:
    • Differentiate manufacturing defect vs environmental damage (e.g., oxidation vs burn residue)
    • Identify contamination sources (flux residues, ionic contamination, foreign debris)
    • Verify alloy composition in leads, solder joints, and bond pads
    • Support counterfeit investigations (material mismatch vs datasheet expectations)
    Additional Material Testing
    • Hermeticity testing
    • Lead finish analysis
    • Cleanliness and contamination evaluation

    Forensic Engineering Applications

    Fire & Electrical Failure Investigations
    • Microscopy and surface characterization
    • Non-Destructive radiography
    • Electrical verification
    Product Liability & Insurance Claims
    • Verify manufacturing defects
    • Distinguish misuse from design failure
    • Provide defensible technical evidence
    Counterfeit Component Analysis
    • Material composition mismatch detection
    • Marking permanency and resurfacing analysis
    • Internal die verification
    Root Cause Failure Analysis
    • Electrical overstress (EOS)
    • Thermal runaway
    • Mechanical or environmental degradation

    Deliverables

    Detailed Technical Reports

    High-resolution Imaging (X-ray, optical)

    Electrical Test Data and Plots

    Failure Mechanism Identification

    Documentation Suitable for Litigation Support

    Why Choose The Lab Worldwide

    • Fast turnaround times
    • Integrated electrical + physical analysis
    • Component-level expertise
    • Flexible support for forensic teams
    • Clear, defensible reporting
    Contact Us Today